Abstract
The EDSFF E3 form factors bring more options and commonality that enterprises and hyperscalers desire compared to traditional U.2, but also bring new challenges. With power envelopes increasing in many cases, it is difficult to fit more components on board to maximize capabilities. With a lack of E3 enclosures on the market, there many uncertainties like enclosure geometries and airflow profiles, and the uncertainty of total system power delivery capability. This presentation will explore the mitigations needed to pack in computational storage components in the E3 1T form factor and maintain thermal control within the constraints of the EDSFF E3 specs.
