Tomas Palkert

System Engineer
Samtec Inc.

Thomas Palkert has done architecture/definition and design of high speed SERDES and optical modules for data center, AI, telecom, storage, military and consumer products. He has been involved in many standardization efforts including Ethernet, Fibre channel, Infiniband, VESA, SFF/SNIA and the OIF. His current work focuses on high speed electrical and optical interfaces for 100G to 1.6Tbit applications. Tom is a Senior member of the IEEE, a past member of the OIF board of directors, past chair of the OIDA silicon photonics alliance and is currently chair of the Fibre Channel T11.2 Physical Layer Task Group, and chair of the SNIA SFF (Small Form Factor) transceiver group. He is also the editor of the OIF CEI-112G-Linear specification. Tom holds BS and MS degrees from the University of Minnesota and holds 5 patents.

This presentation will show how AI and storage interconnects can support 400Gbps lane speeds. Feasibility of copper cabling across intra…

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